Filler-matrix composite is used as PCB laminate and its properties and manufacturability depends on the type of fillers, coupling agents and the resins used.

With the increasing demand for PCBs that are of high power and high circuit density, thermal management has become crucial while designing PCB in order to ensure its reliability. PCB is now the most widely used product to address this problem. It is proven to be able to enhance the thermal reliability of the system. It expedites heat dissipation from its generators such as LED through a thermal conductive dielectric to a heat spreader so that its service life is extended. Several types of PCB are available on the market but the single-layer one is still prevalent due to its simplicity. Mastering this PCB technology requires not only the technique to fabricate it in PCB shops but also the know-how of how to fabricate the thermal conductive dielectric in substrate shops.

Currently, filler-matrix composite is used as PCB laminate and its properties and manufacturability depends on the type of fillers, coupling agents and the resins used. With the help of the Nielsen model and the Agari-Uno model, laminate manufacturers can formulate this dielectric as well as the metal core laminate according to the cost and application requirements of the products. However, the PCB manufacturing technology and most of the patents are mainly held by foreign substrate suppliers and the technology level of the local PCB industry is lagged behind. Extensive effort and research studies in the local industry are needed in order to shorten this technology gap and to produce PCB at lower price.